In situ observation by TEM

Takashi Sumigawa, Takuya Nakano and Takayuki Kitamura
Thin Solid Films, Vol.531, pp.362-372 (2013)

Mixed-Mode Crack Initiation at the Edge of Cu/Si Interface due to Nanoscale Stress Concentration
Kohei Kishimoto, Yabin Yan, Takashi Sumigawa and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.96, pp.72-81 (2012)

Three-dimensional Cohesive Zone Modeling of Interface Crack Initiation from Nanoscale Stress Concentration
Yan Yabin, Takashi Sumigawa, Fuling Shang and Takayuki Kitamura
Journal of Solid Mechanics and Material Engineering, Vol.5, No.2, pp.117-127 (2011)

Evaluation on Plastic Deformation Property of Copper Nano-film by Nano-Scale Cantilever Specimen
Takashi Sumigawa, Tetsuya Shishido, Tadashi Murakami, Tomio Iwasaki and Takayuki Kitamura
Thin Solid Films, Vol.518, pp.6040-6047 (2010)

Interface Crack initiation due to Nanoscale Stress Concentration
Takashi Sumigawa, Tetsuya Shishido, Tadashi Murakami, and Takayuki Kitamura
Materials Science and Engineering A, Vol.527, pp.4796-4803 (2010)

Role of Plasticity on Interface Crack Initiation from a Free Edge and Propagation in a Nano-Component
Hiroyuki Hirakata, Yoshimasa Takahashi, Do Van Truong and Takayuki Kitamura
International Journal of Fracture, 145, pp.261-271 (2007)

Testing by Atomic Force Microscope

Dominant Stress Region of Crack Initiation at Interface Edge of Micro-dot on Substrate
Hiroyuki Hirakata, Yoshimasa Takahashi, Shohei Matsumoto and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.73, pp.2698-2709(2006)

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate
Hiroyuki Hirakata, Takayuki Kitamura and Yoshitake Yamamoto
JSME International Journal, Ser.A, Vol.47, No.3, pp.324-330(2004)

Evaluation of Interface Strength of Micro-Dot on Substrate by means of AFM
Hiroyuki Hirakata, Takayuki Kitamura and Yoshitake Yamamoto
International Journal of Solid and Structures, Vol. 41/11-12, pp.3243-3253(2004)

Cantilever testing

Creep Crack Initiation at a Free Edge of an Interface between Submicron Thick Elements
Hiroyuki Hirakata, Toshihiro Hirako, Yoshimasa Takahashi, Yasunori Matsuoka and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.75, pp.2907-2920 (2008)

Initiation of Interface Crack at Free Edge between Thin Films with Weak Stress Singularity
Takayuki Kitamura, Hiroyuki Hirakata and Do Van Truong
Thin Solid Films, 515, pp.3005-3010 (2007)

Experimental and Theoretical Investigations of Delamination at free Edge of Interface between Piezoelectric Thin Films on a Sustrate
Fulin Shang, Takayuki Kitamura, Hiroyuki Hirakata, Isaku Kanno, Hidetoshi Kotera and K.Terada
International Journal of Solids and Structures, Vo.42, pp.1729-1741(2005)

Pre-cracking Technique for Fracture Mechanics Experiments along Interface between Thin Film and Substrate
Hiroyuki Hirakata, Takayuki Kitamura and Takato Kusano
Engineering Fracture Mechanics, Vol.72, pp.1892-1904 (2005)

Effect of Residual Stress on Delamination from Interface Edge between Nano-Films
Takayuki Kitamura, Hiroyuki Hirakata and Takashi Itsuji
Engineering Fracture Mechanics, Vol.70, pp.2089-2101 (2003)

Crack Initiation at Free Edge of Interface between Thin Films in Advanced LSI
Takayuki Kitamura, Tadahiro Shibutani and Takashi Ueno
Engineering Fracture Mechanics, Vol.69, pp.1289-1299(2002-8)

Characteristic Feature of Slip Bands in Submicron Single Crystal Gold in Fatigue
Takashi Sumigawa, Ryosuke Shiohara, Kenta Matsumoto and Takayuki Kitamura
Acta Materialia, Vol.61, pp.2692-2700 (2013)

Fatigue of 1μm-Scale Gold by Vibration with Reduced Resonant Frequency
Takashi Sumigawa, Kenta Mtatsumoto, Toshiyuki Tsuchiya and Takayuki Kitamura
Materials Science and Engineering A, Vol.556, pp.429-436 (2012)

Effect of Environment on Fatigue Strength of Cu/Si Interface in Nanoscale Components
Yan Yabin, Takashi Sumigawa and Takayuki Kitamura
Materials Science and Engineering A, Vol.556 pp.147-154 (2012)

Fatigue strength of Cu/Si Interface in nano-component
Takashi Sumigawa, Tadashi Murakami and Takayuki Kitamura
Materials Science & Engineering A, Vol.528, pp.5158-5163(2011)

Cu/Si Interface Fracture Due to Fatigue of Cooper Film in Nanometer Scale
Takashi Sumigawa, Tadashi Murakami, Tetsuya Shishido and Takayuki Kitamura
Materials Science and Engineering A, Vol.527, pp.6518-6523 (2010)

Fatigue Crack Growth along Interface between Metal and Ceramics Submicron-thick Films in Inert Environment
Hiroyuki Hirakata, Masaya Kitazawa and Takayuki Kitamura
Acta Materialia, Vol.54, pp.89-97(2006)

Effect of Loading Frequency on Fatigue Crack Growth between a Submicron-Thick Film and a Substrate
Do Van Truong, Hiroyuki Hirakata and Takayuki Kitamura
JSME International Journal, Vol.49, No.3, pp.370-375 (2006)

Stress Singularity Transition of Generic Wedges Due To Nanoelement Layer
Taisuke Sueda, Insu Jeon, Takashi Sumigawa and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.78, pp.2789-2799(2011)

Effect of Interface Layer Comprised of Nano-Springs on Stress Field near Interface Edge
Takashi Sumigawa, Taisuke Sueta, Yuya Futamura, Motofumi Suzuki and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.76, pp.1336-1344(2009)

Disappearance of Stress Singularity at Interface Edge due to Nanostructured Thin Film
Takashi Sumigawa, Hiroyuki Hirakata, Masaki Takemura, Shohei Matsumoto, Motofumi Suzuki and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.75, pp.3073-3083 (2008)

Anisotropic Deformation of Thin Films Comprised of Helical Nanosprings
Hiroyuki Hirakata, Shohei Matsumoto, Masaki Takemura, Motofumi Suzuki and Takayuki Kitamura
International Journal of Solids and Structures, Vol44, pp.4030-4038(2007)