In situ observation by TEM

Takashi Sumigawa, Takuya Nakano and Takayuki Kitamura
Thin Solid Films, Vol.531, pp.362-372 (2013)

Mixed-Mode Crack Initiation at the Edge of Cu/Si Interface due to Nanoscale Stress Concentration
Kohei Kishimoto, Yabin Yan, Takashi Sumigawa and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.96, pp.72-81 (2012)

Three-dimensional Cohesive Zone Modeling of Interface Crack Initiation from Nanoscale Stress Concentration
Yan Yabin, Takashi Sumigawa, Fuling Shang and Takayuki Kitamura
Journal of Solid Mechanics and Material Engineering, Vol.5, No.2, pp.117-127 (2011)

Evaluation on Plastic Deformation Property of Copper Nano-film by Nano-Scale Cantilever Specimen
Takashi Sumigawa, Tetsuya Shishido, Tadashi Murakami, Tomio Iwasaki and Takayuki Kitamura
Thin Solid Films, Vol.518, pp.6040-6047 (2010)

Interface Crack initiation due to Nanoscale Stress Concentration
Takashi Sumigawa, Tetsuya Shishido, Tadashi Murakami, and Takayuki Kitamura
Materials Science and Engineering A, Vol.527, pp.4796-4803 (2010)

Role of Plasticity on Interface Crack Initiation from a Free Edge and Propagation in a Nano-Component
Hiroyuki Hirakata, Yoshimasa Takahashi, Do Van Truong and Takayuki Kitamura
International Journal of Fracture, 145, pp.261-271 (2007)

Testing by Atomic Force Microscope

Dominant Stress Region of Crack Initiation at Interface Edge of Micro-dot on Substrate
Hiroyuki Hirakata, Yoshimasa Takahashi, Shohei Matsumoto and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.73, pp.2698-2709(2006)

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate
Hiroyuki Hirakata, Takayuki Kitamura and Yoshitake Yamamoto
JSME International Journal, Ser.A, Vol.47, No.3, pp.324-330(2004)

Evaluation of Interface Strength of Micro-Dot on Substrate by means of AFM
Hiroyuki Hirakata, Takayuki Kitamura and Yoshitake Yamamoto
International Journal of Solid and Structures, Vol. 41/11-12, pp.3243-3253(2004)

Cantilever testing

Creep Crack Initiation at a Free Edge of an Interface between Submicron Thick Elements
Hiroyuki Hirakata, Toshihiro Hirako, Yoshimasa Takahashi, Yasunori Matsuoka and Takayuki Kitamura
Engineering Fracture Mechanics, Vol.75, pp.2907-2920 (2008)

Initiation of Interface Crack at Free Edge between Thin Films with Weak Stress Singularity
Takayuki Kitamura, Hiroyuki Hirakata and Do Van Truong
Thin Solid Films, 515, pp.3005-3010 (2007)

Experimental and Theoretical Investigations of Delamination at free Edge of Interface between Piezoelectric Thin Films on a Sustrate
Fulin Shang, Takayuki Kitamura, Hiroyuki Hirakata, Isaku Kanno, Hidetoshi Kotera and K.Terada
International Journal of Solids and Structures, Vo.42, pp.1729-1741(2005)

Pre-cracking Technique for Fracture Mechanics Experiments along Interface between Thin Film and Substrate
Hiroyuki Hirakata, Takayuki Kitamura and Takato Kusano
Engineering Fracture Mechanics, Vol.72, pp.1892-1904 (2005)

Effect of Residual Stress on Delamination from Interface Edge between Nano-Films
Takayuki Kitamura, Hiroyuki Hirakata and Takashi Itsuji
Engineering Fracture Mechanics, Vol.70, pp.2089-2101 (2003)

Crack Initiation at Free Edge of Interface between Thin Films in Advanced LSI
Takayuki Kitamura, Tadahiro Shibutani and Takashi Ueno
Engineering Fracture Mechanics, Vol.69, pp.1289-1299(2002-8)