界面端・内部き裂発生

・Cu/Si Interface Fracture due to Fatigue of Copper Film in Nanometer Scale
Takashi Sumigawa, Tadashi Murakami, Tetsuya Shishido, and Takayuki Kitamura
Material Science and Engineering A, Vol. 527 (2010) pp. 6518-6523.


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・Strength Evaluation of Selected Interface in Multi-layered Nano-material
Yan Yabin, Takashi Sumigawa, Licheng Guo, Takayuki Kitamura
Engineering Fracture Mechanics, Vol. 116 (2014) pp. 204-212.


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曲げねじり試験
・Mixed-mode crack initiation at the edge of Cu/Si interface due to nanoscale stress concentration
Kohei Kishimoto, Yabin Yan, Takashi Sumigawa, Takayuki Kitamura
Engineering Fracture Mechanics, Vol. 96 (2012) pp. 72-81.


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疲労試験
・Fatigue Strength of the Cu/Si Interface in Nano-components
Takashi Sumigawa, Tadashi Murakami, and Takayuki Kitamura
Material Science and Engineering A, Vol. 528 (2011) pp. 5158-5163.


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・桂キャンパスCクラスタ 　

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・桂キャンパスからの夜景

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・吉田キャンパス

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